0.7mil/19um Silver Alloy Bonding Wire

• Type: Bare
• Conductor Type: Alloy
• Application: Microelectronics, LED Packaging, IC Packaging
• Conductor Material: Alloy
• Material Shape: Round Wire
• Range of Application: Microelectronics, LED Packaging, IC Packaging
• Certification: ISO9001, CE, CCC, RoHS
• Length: 500m or 1000m
• Wire Diameter: 0.7-3.0mil
• Material: Au, AG, Pd, Cu
• Content: Customized
• Transport Package: Bubble Chamber, Paper Box
• Origin: China
• Production Capacity: 100000

Product Description

 

Product Description

 Specifications
1. Alloy welding wire
2. New type inner lead
3. Advanced tech manufacture
4. Certification: ISO, RoHS, MSDS, Reach

Alloy bonding wire is a new type of inner lead material launched by us to meet market demand. The surface has excellent antioxidant capacity, no need for protective gas during bonding. It has totally same hardness and wire hardness as gold bonding wire, all bonding welding parameters are the same as gold bonding wire but lower-cost.

Features of products
1. Excellent antioxidant capacity on surface
2. No need for protective gas during bonding
3. Same hardness and wire hardness as gold bonding wire
4. Lower cost than gold bonding wire

Diameter
From 0.018mm, 0.02mm, 0.023mm, 0.025mm, 0.03mm

OEM, ODM or other special orders welcome.

Product Parameters

 

 

Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.

Products of each project team:

1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)

2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)

3. Copper alloy (silver copper alloy, tin copper alloy)

4. Stranded enameled wire (polyimide, polyurethane )

5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)

6. Imported chips (Infineon, Ansemy, ST, TI)