Type: | Bare |
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Conductor Type: | Alloy |
Application: | Microelectronics, LED Packaging, IC Packaging |
Conductor Material: | Alloy |
Material Shape: | Round Wire |
Range of Application: | Microelectronics, LED Packaging, IC Packaging |
Customization: |
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Suppliers with verified business licenses
Specifications
1. Alloy welding wire
2. New type inner lead
3. Advanced tech manufacture
4. Certification: ISO, RoHS, MSDS, Reach
Alloy bonding wire is a new type of inner lead material launched by us to meet market demand. The surface has excellent antioxidant capacity, no need for protective gas during bonding. It has totally same hardness and wire hardness as gold bonding wire, all bonding welding parameters are the same as gold bonding wire but lower-cost.
Features of products
1. Excellent antioxidant capacity on surface
2. No need for protective gas during bonding
3. Same hardness and wire hardness as gold bonding wire
4. Lower cost than gold bonding wire
Diameter
From 0.018mm, 0.02mm, 0.023mm, 0.025mm, 0.03mm
OEM, ODM or other special orders welcome.
Suppliers with verified business licenses