• 1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging

1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging

Type: Bare
Conductor Type: Alloy
Application: Microelectronics, LED Packaging, IC Packaging
Conductor Material: Alloy
Material Shape: Round Wire
Range of Application: Microelectronics, LED Packaging, IC Packaging
Customization:
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  • Overview
  • Product Description
  • Product Parameters
Overview

Basic Info.

Certification
ISO9001, CE, CCC, RoHS
Length
500m or 1000m
Wire Diameter
0.7-3.0mil
Material
Au, AG, Pd, Cu
Transport Package
Bubble Chamber, Paper Box
Origin
China
Production Capacity
100000

Product Description

1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
 
Product Description

 Copper Bonding WireGold Alloy Bonding Wire
Silver Alloy Bonding Wire
Bonding Wire are mostly used for IC & LED packaging. The types we have are: Aluminum Silicon bonding wire, Silver Alloy Bonding Wire, Pd coated Copper wire.
TX Copper (Cu) bondingwireoffers significant cost advantage over Gold (Au) bonding wire. Our Cu bonding wire is an excellent replacement for Au bonding wire due to its similar electrical properties and the cost advantages.
Self inductance and self capacitance are nearly the same and Cu bonding wire has lower resistivity. 
In applications of QFP, QFN and SOIC where resistance due to bond wire can negatively impact circuit performance, using TX Cu bonding wire can offer better improvement. Also, a tailor-made concept of TX Tech is partnering with various interested parties for advanced packaging to continue to expand knowledge and lead technology development.
More infomation can view here.

Product Parameters

 

 
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.

Products of each project team:

1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)

2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)

3. Copper alloy (silver copper alloy, tin copper alloy)

4. Stranded enameled wire (polyimide, polyurethane )

5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)

6. Imported chips (Infineon, Ansemy, ST, TI)
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
 
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
 

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Gold Member Since 2022

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Manufacturer/Factory
Registered Capital
3000000 RMB
Plant Area
101~500 square meters