• High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
  • High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
  • High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
  • High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
  • High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
  • High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor

High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor

Insulation Level: H
Certification: ISO9001, CE, CCC, RoHS
Application: Instrument
Shape: Particle
Conductor Material: Gold
Material: Gold
Customization:
Gold Member Since 2022

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Manufacturer/Factory
  • Overview
  • Product Description
  • Product Parameters
Overview

Basic Info.

Model NO.
metal material
Specifications
Accept Customization
Gold Target Content
99% - 99.99%
Transport Package
Spool/Coil, Carton, Wooden Case
Origin
China

Product Description

 
Product Description
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor


 

Product Parameters

The high-purity evaporated gold refers to high-purity gold or gold alloy

Put it into the evaporation and plating crucible in order, heat it to a certain high temperature by electron beam, and the gold will

These "gases" become gases, which are attached layer by layer to the semiconductor core in the crucible

On the chip, a metal semiconductor system is formed, which is used to transmit signals.

Evaporated gold is mainly used in 5G and third-generation compound semiconductor materials, including

High conversion semiconductors for civil microwave communication devices, aerospace and other important fields

Body compound chip, etc.

High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.

Products of each project team:

1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)

2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)

3. Copper alloy (silver copper alloy, tin copper alloy)

4. Stranded enameled wire (polyimide, polyurethane )

5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)

6. Imported chips (Infineon, Ansemy, ST, TI)
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor
High-Purity Metal Material Gold Particle Target Corrosion Resistance for Semiconductor

 

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Gold Member Since 2022

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Manufacturer/Factory
Registered Capital
3000000 RMB
Plant Area
101~500 square meters