1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging

Product Details
Customization: Available
Type: Bare
Conductor Type: Alloy
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Registered Capital
3000000 RMB
Plant Area
1001~2000 square meters
  • 1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • 1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
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  • Overview
  • Product Description
  • Product Parameters
Overview

Basic Info.

Application
Microelectronics, LED Packaging, IC Packaging
Conductor Material
Copper
Material Shape
Round Wire
Range of Application
Microelectronics, LED Packaging, IC Packaging
Certification
ISO9001, CE, CCC, RoHS
Length
500m or 1000m
Wire Diameter
0.7-3.0mil
Transport Package
Bubble Chamber, Paper Box
Origin
China

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
 
Product Description

 Copper Bonding WireGold Alloy Bonding Wire
Silver Alloy Bonding Wire
Bonding Wire are mostly used for IC & LED packaging. The types we have are: Aluminum Silicon bonding wire, Silver Alloy Bonding Wire, Pd coated Copper wire.
TX Copper (Cu) bondingwireoffers significant cost advantage over Gold (Au) bonding wire. Our Cu bonding wire is an excellent replacement for Au bonding wire due to its similar electrical properties and the cost advantages.
Self inductance and self capacitance are nearly the same and Cu bonding wire has lower resistivity. 
In applications of QFP, QFN and SOIC where resistance due to bond wire can negatively impact circuit performance, using TX Cu bonding wire can offer better improvement. Also, a tailor-made concept of TX Tech is partnering with various interested parties for advanced packaging to continue to expand knowledge and lead technology development.
More infomation can view here.

Product Parameters

 

 
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.

Products of each project team:

1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)

2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)

3. Copper alloy (silver copper alloy, tin copper alloy)

4. Stranded enameled wire (polyimide, polyurethane )

5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)

6. Imported chips (Infineon, Ansemy, ST, TI)
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
 
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
1.0mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
 

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