1.15mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
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Product Attributes
- Customization
- Available
- Type
- Bare
- Conductor Type
- Alloy
- Model NO.
- 1.15mil
- Application
- Microelectronics, LED Packaging, IC Packaging
- Conductor Material
- Alloy
- Material Shape
- Round Wire
- Range of Application
- Microelectronics, LED Packaging, IC Packaging
- Certification
- ISO9001, CE, CCC, RoHS
- Length
- 500m or 1000m
- Wire Diameter
- 0.7-3.0mil
- Material
- Au, AG, Pd, Cu
- Transport Package
- Bubble Chamber, Paper Box
- Origin
- China
- Production Capacity
- 100000
- Package Size
- 10.00cm * 10.00cm * 10.00cm
- Package Gross Weight
- 1.000kg
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of 1.15mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
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Product Description
Copper Bonding WireGold Alloy Bonding Wire
Silver Alloy Bonding Wire
Bonding Wire are mostly used for IC & LED packaging. The types we have are: Aluminum Silicon bonding wire, Silver Alloy Bonding Wire, Pd coated Copper wire.
TX Copper (Cu) bondingwireoffers significant cost advantage over Gold (Au) bonding wire. Our Cu bonding wire is an excellent replacement for Au bonding wire due to its similar electrical properties and the cost advantages.
Self inductance and self capacitance are nearly the same and Cu bonding wire has lower resistivity.
In applications of QFP, QFN and SOIC where resistance due to bond wire can negatively impact circuit performance, using TX Cu bonding wire can offer better improvement. Also, a tailor-made concept of TX Tech is partnering with various interested parties for advanced packaging to continue to expand knowledge and lead technology development.
More infomation can view here.
Products of each project team:
1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)
2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)
3. Copper alloy (silver copper alloy, tin copper alloy)
4. Stranded enameled wire (polyimide, polyurethane )
5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)
6. Imported chips (Infineon, Ansemy, ST, TI)
About the Supplier
This supplier has been audited by SGS. Verify the report on the official SGS website with ID "QIP-ASI2221390". Items marked "" are certified.
Company Profile
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.
Products of each project team:
1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)
2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)
3. Copper alloy (silver copper alloy, tin copper alloy)
4. Stranded enameled wire (polyimide, polyurethane )
5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)
6. Imported chips (Infineon, Ansemy, ST, TI)
Precious Metal Alloys
- Platinum Iridium: This alloy combines the durability and hardness of iridium with the corrosion resistance and other properties of platinum. It is used in high-temperature applications, electrical contacts, and precision instruments.
- Platinum Rhodium: With good catalytic properties and high-temperature resistance, it is used in catalytic converters, thermocouples, and other industrial applications.
- Gold and Silver: The combination of gold and silver alloys can offer a balance of properties such as conductivity, malleability, and aesthetic appeal, used in jewelry, electronics, and other industries.
- Gold and Silver Palladium: Palladium addition can improve the mechanical properties and corrosion resistance of the alloy, making it suitable for various applications in electronics and jewelry.
- Copper Palladium: This alloy may have enhanced electrical and mechanical properties, used in electrical connectors and other components.
- Silver Palladium: It can provide good conductivity and solderability, often used in electronic packaging and electrical contacts.
- Gold and Tin Alloys: Used in soldering and bonding applications, especially in semiconductor packaging due to their good wetting properties and reliability.
About Our Factory & Business Background
- Address
- No. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China
- Terms of Payment
- T/T
- International Commercial Terms(Incoterms)
- FOB
- Average Lead Time
-
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays - Nearest Port
- shenzhen
Our Production Capability & Technical Expertise
Our Industry Experience & Global Business Record
- Export Year
- 2023-01-03
- Main Markets
- North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
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