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New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging pictures & photos
New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging pictures & photos
New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging pictures & photos
New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging pictures & photos
New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging pictures & photos
New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging pictures & photos
  • New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
  • New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
Type: Bare
Material Shape: Round Wire
Certification: ISO9001, CE, CCC, RoHS
Length: 500m or 1000m
Wire Diameter: 0.7-3.0mil
Material: Au, AG, Pd, Cu
Customization:

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