0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED
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Product Highlights
- High Purity Gold Content: Main body is pure gold with Au > 99.999% and 99.99% gold content.
- Stable Performance: Features stable arc, stable conductivity, and excellent corrosion resistance.
- Wide Application Scope: Suitable for IC, LED, LAMP, SMD, Piranha packaging, and triode applications.
- Comprehensive Certifications: Certified with ISO9001, CE, CCC, and RoHS standards.
- Long Storage Validity: Valid storage period is 12 months under proper dry and ventilated conditions.
- Rapid Lead Time: Average lead time within 15 workdays for both peak and off-peak seasons.
- Tailored Solutions: Special parameters and requirements can be tailored for enterprise needs.
Product Attributes
- Customization
- Available
- Type
- Bare
- Material Shape
- Flat Wire
- Certification
- ISO9001, CE, CCC, RoHS
- Width Size Factory
- ±5%
- Thickness Dimension Factory
- ±10%
- Gold Content
- 99.99%
- Shaft Dimensions
- 0.5 Inch 2inch
- Transport Package
- Bubble Chamber, Paper Box
- Origin
- China
- Production Capacity
- 100000
- Package Size
- 10.00cm * 10.00cm * 10.00cm
- Package Gross Weight
- 1.000kg
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of 0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED
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0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED -
0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED -
0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED -
0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED -
0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED -
0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED -
0.8mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED
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Product Description
Description
The main body is pure gold (Au > 99.999%), adding beryllium, rare earth and other trace elements, through smelting, wire drawing, heat treatment and other processes to obtain different properties, to meet the different needs of gold wire, gold bonding wire is the most stable in all bonding wire.
Feature
The arc is stable, the conductivity is stable and corrosion resistant. It provides reliable guarantee for the stability of the product.
Application
Suitable for microelectronics industry package, in LAMP,SMD,Piranha and other LED packaging and triode, IC package.
Working environment
Must open the test and use in clean areas when in use, it is prohibited to open without purification of the working environment, to avoid contamination of the product, product quality problems caused by the sulfur free,it should be finished after opening 24 hours. In the environment, humidity is lower than 40%, to ensure no pollution situations use up in 48 hours after opening.
Storage
Requiring ventilation, dry, bright, clean and unobstructed, the storage is valid for 12 months.
Products of each project team:
1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)
2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)
3. Copper alloy (silver copper alloy, tin copper alloy)
4. Stranded enameled wire (polyimide, polyurethane )
5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)
6. Imported chips (Infineon, Ansemy, ST, TI)
About the Supplier
This supplier has been audited by SGS. Verify the report on the official SGS website with ID "QIP-ASI2221390". Items marked "
" are certified.
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Company Profile
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.
Products of each project team:
1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)
2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)
3. Copper alloy (silver copper alloy, tin copper alloy)
4. Stranded enameled wire (polyimide, polyurethane )
5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)
6. Imported chips (Infineon, Ansemy, ST, TI)
Precious Metal Alloys
- Platinum Iridium: This alloy combines the durability and hardness of iridium with the corrosion resistance and other properties of platinum. It is used in high-temperature applications, electrical contacts, and precision instruments.
- Platinum Rhodium: With good catalytic properties and high-temperature resistance, it is used in catalytic converters, thermocouples, and other industrial applications.
- Gold and Silver: The combination of gold and silver alloys can offer a balance of properties such as conductivity, malleability, and aesthetic appeal, used in jewelry, electronics, and other industries.
- Gold and Silver Palladium: Palladium addition can improve the mechanical properties and corrosion resistance of the alloy, making it suitable for various applications in electronics and jewelry.
- Copper Palladium: This alloy may have enhanced electrical and mechanical properties, used in electrical connectors and other components.
- Silver Palladium: It can provide good conductivity and solderability, often used in electronic packaging and electrical contacts.
- Gold and Tin Alloys: Used in soldering and bonding applications, especially in semiconductor packaging due to their good wetting properties and reliability.
About Our Factory & Business Background
- Address
- No. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China
- Terms of Payment
- T/T
- International Commercial Terms(Incoterms)
- FOB
- Average Lead Time
-
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays - Nearest Port
- shenzhen
Our Production Capability & Technical Expertise
Our Industry Experience & Global Business Record
- Export Year
- 2023-01-03
- Main Markets
- North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
FAQ
- What is the gold purity level?
- The main body is pure gold with Au > 99.999%, and gold content is 99.99%.
- What certifications does the product have?
- The product holds ISO9001, CE, CCC, and RoHS certifications.
- How long is the storage validity?
- The storage is valid for 12 months when kept in a ventilated, dry, and clean environment.
- What is the lead time for orders?
- The average lead time is within 15 workdays for both peak and off-peak seasons.
- Can products be tailored to specific requirements?
- Yes, we can tailor products with special parameters and requirements for enterprises.
- What are the usage environment requirements?
- Must be used in clean areas; humidity should be lower than 40% to avoid pollution.
- What is the payment term?
- The accepted payment term is T/T.
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