| Customization: | Available |
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| Type: | Bare |
| Conductor Type: | Alloy |
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| Key Component | Description and Features |
|---|---|
| Gold Alloy Wire Bond | Key component for IC and LED packaging |
| Silver Alloy Wire Bond | Key component for IC and LED packaging |
| Types Available | Aluminum-Silicon Wire Bond, Silver Alloy Wire Bond, Palladium-Coated Copper Wire |
| TX Copper (Cu) Wire Bond | Significant cost advantage over Gold (Au) Wire Bond due to similar electrical performance and cost benefits |
| Electrical Performance | The self-inductance and self-capacitance of Copper Wire Bond are essentially the same as those of Gold Wire Bond, with lower resistivity |
| Application Impact | In applications such as QFP, QFN, and SOIC, the resistance of the wire bond can negatively impact circuit performance. The use of TXCu Wire Bond can provide better improvement |
| Advanced Packaging Collaboration | TXTech's tailored concept is collaborating with various parties for advanced packaging to continue expanding knowledge and leading technological development |
Copper Bonding WireGold Alloy Bonding Wire
Silver Alloy Bonding Wire
Bonding Wire are mostly used for IC & LED packaging. The types we have are: Aluminum Silicon bonding wire, Silver Alloy Bonding Wire, Pd coated Copper wire.
TX Copper (Cu) bondingwireoffers significant cost advantage over Gold (Au) bonding wire. Our Cu bonding wire is an excellent replacement for Au bonding wire due to its similar electrical properties and the cost advantages.
Self inductance and self capacitance are nearly the same and Cu bonding wire has lower resistivity.
In applications of QFP, QFN and SOIC where resistance due to bond wire can negatively impact circuit performance, using TX Cu bonding wire can offer better improvement. Also, a tailor-made concept of TX Tech is partnering with various interested parties for advanced packaging to continue to expand knowledge and lead technology development.
More infomation can view here.
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