Bonding alloy wire is usually made of a mixture of gold, aluminum, copper, silver, tungsten and other materials, and the composition ratio of different materials is different, which will also affect the performance of bonding wire, and different application fields will choose different alloy wire materials. Among them, gold wire has the best conductivity but higher cost, aluminum wire has lower cost but poor conductivity, and silver wire has excellent conductivity and reliability, but the cost is also higher. Tungsten wire is used in high-temperature applications.
Bonded alloy wire is widely used in semiconductors, microelectronic packaging and other fields, including smart phones, televisions, computers, automotive electronics and other fields. With the continuous upgrading of electronic products, the application demand for bonding alloy wire is also increasing, and it is expected to become one of the important supports for the development of the electronics industry in the future.
Bonding alloy wire is an electronic packaging material, it is a metal wire manufactured by bonding technology, usually used for connection and packaging inside chips, with excellent conductivity and reliability, and is widely used in semiconductors, microelectronic packaging and other fields.
){kind=link}