| Customization: | Available |
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| Type: | Bare |
| Conductor Type: | Gold |
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| Key | Description |
|---|---|
| 1. Conductivity | Key gold wires need to have good electrical conductivity to ensure the reliability and stability of signal transmission. Different materials of key gold wires vary in electrical conductivity. |
| 2. Solderability | Key gold wires need to have good solderability to ensure a reliable connection with chip pins or packaging substrates. Different materials and diameters of key gold wires also vary in solderability. |
| 3. Reliability | Key gold wires need to have good reliability, capable of withstanding the impact of environmental factors such as temperature, humidity, and mechanical stress, maintaining stable connections and not easily breaking. |
| 4. Size and Diameter | The size and diameter of key gold wires are crucial for chip packaging processes. Appropriate diameters and lengths of key gold wires need to be selected for different packaging processes and application scenarios. |
| 5. Main Uses in Electronic Packaging | Key gold wires have several important uses in electronic packaging, which are detailed below: |
| 6. Chip and Pin Connections | Key gold wires are widely used for connections between chips and pins, achieving electrical connections between chips and packaging substrates through soldering or pressure welding. This is one of the most common and critical applications in the chip packaging process. |
| 7. Internal Chip Interconnections | In some highly integrated chips, to achieve interconnections between various functional modules, key gold wires are used for internal interconnections. Different functional modules are interconnected by winding or passing the metal wire through the internal structure of the chip to achieve signal transmission. |
| 8. Packaging Substrate Connections | Key gold wires are also used to connect chips to packaging substrates. Through soldering or pressure welding, the key gold wire is connected to the packaging substrate to achieve a connection between the chip and the external circuit. |
| 9. Optical Packaging | In the field of optical communication, key gold wires are widely used in the packaging process of optoelectronic devices. By bonding optical fibers and other optical components with chips, the input and output of optical signals are achieved. |
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