0.9mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED
| Customization: | Available |
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| Type: | Wire |
| Conductor Type: | Silver |
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Basic Info.
- Model NO.
- 0.9mil
- Conductor Material
- Alloy
- Sheath Material
- Non
- Insulation Material
- Non
- Material Shape
- Round Wire
- Range of Application
- Bonding Wire
- Certification
- ISO9001, CE, CCC, RoHS
- Brand
- Jnajna Dy
- Width Size Factory
- ±5%
- Thickness Dimension Factory
- ±10%
- Gold Content
- 99.99%
- Shaft Dimensions
- 0.5 Inch 2inch
- Transport Package
- Bubble Chamber, Paper Box
- Specification
- 0.015-0.5MM
- Trademark
- JNAJAN DY
- Origin
- China
Packaging & Delivery
- Package Size
- 10.00cm * 10.00cm * 10.00cm
- Package Gross Weight
- 1.000kg
Product Description
Description
The main body is pure gold (Au > 99.999%), adding beryllium, rare earth and other trace elements, through smelting, wire drawing, heat treatment and other processes to obtain different properties, to meet the different needs of gold wire, gold bonding wire is the most stable in all bonding wire.
Feature
The arc is stable, the conductivity is stable and corrosion resistant. It provides reliable guarantee for the stability of the product.
Application
Suitable for microelectronics industry package, in LAMP,SMD,Piranha and other LED packaging and triode, IC package.
Working environment
Must open the test and use in clean areas when in use, it is prohibited to open without purification of the working environment, to avoid contamination of the product, product quality problems caused by the sulfur free,it should be finished after opening 24 hours. In the environment, humidity is lower than 40%, to ensure no pollution situations use up in 48 hours after opening.
Storage
Requiring ventilation, dry, bright, clean and unobstructed, the storage is valid for 12 months.
Products of each project team:
1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)
2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)
3. Copper alloy (silver copper alloy, tin copper alloy)
4. Stranded enameled wire (polyimide, polyurethane )
5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)
6. Imported chips (Infineon, Ansemy, ST, TI)
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