Solderable Polyesterimide Enamelled Round Copper Wire, Class 180, with a Bonding Layer (EI/SBS/180)

• Customization: Available
• Insulation Level: H
• Certification: ISO9001, CE, CCC, RoHS
• Application: Earphone,Cabel
• Shape: Round Wire
• Conductor Material: Alloy Wire
• Min Elongation Rate: >23%
• Min Dielectric Strength: >3.1kv
• Max.Conductor Resistance: 8.918Ω/M
• Max.Overail Diameter: 0.064mm
• Transport Package: Bubble Chamber, Paper Box
• Origin: China
• Production Capacity: 100000
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 1.000kg

Product Description

Conductor diameter/tolerance	0.05mm
Max.overail diameter	0.064mm
Min dielectric strength	>3.1KV
Max.conductor resistance	8.918Ω/m

4N single crystal copper material can increase the coating according to customer needs, and help to increase the enamel coating to meet the high-end application requirements of oxidation resistance and high temperature resistance. The single crystal production equipment of the factory has the production capacity of single crystal materials, and can provide material purity reports, so that customers can rest assured.

 

Product Description

 

Company Profile

Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.

Products of each project team:

1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)

2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)

3. Copper alloy (silver copper alloy, tin copper alloy)

4. Stranded enameled wire (polyimide, polyurethane )

5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)

6. Imported chips (Infineon, Ansemy, ST, TI)