Gold Bonding Wire Widely Used in Electronic Components for IC/LED

Product Details
Customization: Available
Type: Bare
Material Shape: Flat Wire
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Registered Capital
3000000 RMB
Plant Area
1001~2000 square meters
  • Gold Bonding Wire Widely Used in Electronic Components for IC/LED
  • Gold Bonding Wire Widely Used in Electronic Components for IC/LED
  • Gold Bonding Wire Widely Used in Electronic Components for IC/LED
  • Gold Bonding Wire Widely Used in Electronic Components for IC/LED
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  • Overview
  • Certifications
  • Our Advantages
Overview

Basic Info.

Width Size Factory
±5%
Thickness Dimension Factory
±10%
Gold Content
99.99%
Shaft Dimensions
0.5 Inch 2inch
Transport Package
Bubble Chamber, Paper Box
Origin
China

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

Gold Bonding Wire Widely Used in Electronic Components for IC/LED
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
 
Certifications

Description
The main body is pure gold (Au > 99.999%), adding beryllium, rare earth and other trace elements, through smelting, wire drawing, heat treatment and other processes to obtain different properties, to meet the different needs of gold wire, gold bonding wire is the most stable in all bonding wire.
 
Feature
The arc is stable, the conductivity is stable and corrosion resistant. It provides reliable guarantee for the stability of the product.
 
Application
Suitable for microelectronics industry package, in LAMP,SMD,Piranha and other LED packaging and triode, IC package.
 
Working environment
Must open the test and use in clean areas when in use, it is prohibited to open without purification of the working environment, to avoid contamination of the product, product quality problems caused by the sulfur free,it should be finished after opening 24 hours. In the environment, humidity is lower than 40%, to ensure no pollution situations use up in 48 hours after opening.
 
Storage
Requiring ventilation, dry, bright, clean and unobstructed, the storage is valid for 12 months.

Our Advantages

 

 
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.

Products of each project team:

1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)

2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)

3. Copper alloy (silver copper alloy, tin copper alloy)

4. Stranded enameled wire (polyimide, polyurethane )

5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)

6. Imported chips (Infineon, Ansemy, ST, TI)
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
 
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
 

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