• 0.7mil Palladium Plating Copper Wire for LED/IC Bonding
  • 0.7mil Palladium Plating Copper Wire for LED/IC Bonding
  • 0.7mil Palladium Plating Copper Wire for LED/IC Bonding
  • 0.7mil Palladium Plating Copper Wire for LED/IC Bonding
  • 0.7mil Palladium Plating Copper Wire for LED/IC Bonding
  • 0.7mil Palladium Plating Copper Wire for LED/IC Bonding

0.7mil Palladium Plating Copper Wire for LED/IC Bonding

Elongation: 3-15
Breaking Load: >4
Length: 1000m
Cu: >97%
Pd: 1-2%
Transport Package: Bubble Chamber, Paper Box
Customization:
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Manufacturer/Factory

Basic Info.

Model NO.
Palladium
Origin
China
Production Capacity
100000

Product Description

Elongation 3-15%
Breaking load >4
length 0.017Ω/km
Thickness of coating 0.1um
 
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
 
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
Shenzhen Silver Technologies Ltd mainly acts as an agent, develops, produces and sells packaging tools and materials such as single crystal copper, copper alloy, key alloy wire, gold palladium copper wire, alloy wire, super-soft copper wire, packaged gold tape, pure aluminum wire, cleaver, steel nozzle, film, etc. At the same time, it can also tailor products with special parameters and requirements for enterprises.

Products of each project team:

1. High purity metal (pure platinum wire, pure gold particles, high purity silver wire, high purity single crystal copper)

2. Precious metal alloys (platinum iridium, platinum rhodium, gold and silver, gold and silver palladium, copper palladium, silver palladium, gold and tin alloys)

3. Copper alloy (silver copper alloy, tin copper alloy)

4. Stranded enameled wire (polyimide, polyurethane )

5. Semiconductor materials (key alloy belt, key alloy wire, gold palladium copper wire, pure aluminum wire, steel nozzle, cleaver)

6. Imported chips (Infineon, Ansemy, ST, TI)
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
 
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
0.7mil Palladium Plating Copper Wire for LED/IC Bonding
0.7mil Palladium Plating Copper Wire for LED/IC Bonding

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Gold Member Since 2022

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Manufacturer/Factory
Registered Capital
3000000 RMB
Plant Area
101~500 square meters